Most Complex PCBA-industrial control motherboard
Industrial control PCBA
In the realm of industrial control products, PCB assembly stands out as a particularly complex and representative process, typically involving SMT, DIP, and hand soldering techniques.
This is due to the high volume of components, including a significant number of special-shaped devices, particularly those with comparative capacitance such as row plugs. Additionally, the process often involves BGA chips, which further increases its complexity and cost.
Given these challenges, PCB assembly requires a high level of expertise from engineers and workers, as any mistakes can result in significant losses. Therefore, the ability to handle such complex PCB assemblies is a crucial test for any PCB assembly plant.
Industrial control PCBA
- IC Type: BGA QFN
- Classification:industrial control motherboard
- Workmanship:SMT+DIP+soldering techniques.
- Solder paste:Environmental protection, lead-free solder paste
- Double Panel:Yes
- Cooperation Type:OEM(PCB+PCBA)
- Components type : BGA, uBGA, QFN, POP, smallest size 01005/0201
- Min. IC Pitch: 0.012’’ (0.3mm)
- FN Lead Pitch: 0.012’’ (0.3mm)
- Min. BGA sizes: 0.012’’ (0.3mm)
Industrial control PCBA
- IC Type: BGA QFN
- Classification:industrial control motherboard
- Workmanship:SMT+DIP+soldering techniques.
- Solder paste:Environmental protection, lead-free solder paste
- Double Panel:Yes
- Cooperation Type:OEM(PCB+PCBA)
- Components type : BGA, uBGA, QFN, POP, smallest size 01005/0201
- Min. IC Pitch: 0.012’’ (0.3mm)
- FN Lead Pitch: 0.012’’ (0.3mm)
- Min. BGA sizes: 0.012’’ (0.3mm)
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