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Advanced Equipment
STARTSMALL runs a fully equipped PCBA line — from solder paste printing, component placement, reflow and wave soldering, through multi-stage inspection (3D SPI, AOI, X-Ray, ICT), to post-process operations such as depaneling, baking, laser marking and conformal coating, supported by climate-controlled storage and reliability testing.
🔴 SRC 01
STEP 01 · PRINTING
Automatic Solder Paste Printing Machine
Solder Paste Printer
Deposits solder paste onto PCB pads through a stencil — the first step of SMT. Print accuracy directly determines the quality of downstream placement and reflow.
🔴 SRC 02
STEP 02 · INSPECTION
3D SPI
3D Solder Paste Inspection
Scans paste height, volume, and area in 3D before reflow. Out-of-spec boards are flagged at this stage to prevent defects from propagating downstream.
🔴 SRC 03
STEP 03 · PLACEMENT
FUJI NXT III SMT Machine
FUJI NXT III Pick-and-Place
High-speed placement of resistors, capacitors, ICs and other SMDs. Supports package sizes from 01005 up to large QFP and BGA.
🔴 SRC 04
STEP 04 · SOLDERING
Reflow Oven
Reflow Soldering Oven
Multi-zone reflow oven forms the metallurgical bond between components and PCB pads. Thermal profile is tuned per board thickness and component mix to avoid cold joints and component overheating.
🔴 SRC 05
STEP 05 · SOLDERING
Wave Soldering
Wave Soldering System
Used for through-hole (THT) components. Dual-wave process supports mixed-technology boards — SMT side is populated first, then THT leads are soldered in a single wave pass.
🔴 SRC 06
STEP 06 · INSPECTION
AOI
Automated Optical Inspection
Post-reflow camera scan checks each board for missing parts, misalignment, tombstoning, and insufficient solder. AOI-flagged sites are reviewed by QA before packing.
🔴 SRC 07
STEP 07 · INSPECTION
X-RAY
X-Ray Inspection
BGA and QFN solder joints are hidden beneath the package and invisible to AOI. X-Ray verifies shorts, voids, and bridges in the ball grid.
🔴 SRC 08
STEP 08 · INSPECTION
First Sample Inspection Machine
First Article Inspection
Full inspection of the first board off the line — BOM, polarity, orientation, and solder joints — before batch release. Prevents costly batch rework.
🔴 SRC 09
STEP 09 · TESTING
ICT Machine
In-Circuit Tester
Bed-of-nails fixture checks for opens, shorts, and out-of-spec component values against the test program. Catches electrical defects before shipment. Customer-supplied fixtures are used when provided.
🔴 SRC 10
STEP 10 · POST-PROCESS
Automatic Board Splitter
Automatic Depaneling
Separates panels into individual boards. V-cut panels are processed with a guillotine-style cutter; tab-routed panels use a router — both with low mechanical stress on components.
🔴 SRC 11
STEP 11 · POST-PROCESS
Oven
Curing & Baking Oven
Used for baking, moisture removal, and curing. Moisture-sensitive devices are pre-baked per J-STD-033 to prevent popcorn and void defects during reflow.
🔴 SRC 12
STEP 12 · POST-PROCESS
Laser Printing Machine
Laser Marking System
Marks serial numbers, batch codes, and production dates directly on the PCBA surface for full traceability. Custom marking formats are supported per customer request.
🔴 SRC 13
STEP 13 · POST-PROCESS
Conformal Coating Machine
Conformal Coating System
Applies a protective coating that guards PCBA surfaces against moisture, dust, and corrosion. Standard for outdoor, industrial, and automotive power applications.
🔴 SRC 14
STEP 14 · STORAGE
Constant Temperature & Humidity Chamber
Climate-Controlled Storage
Stores ICs and moisture-sensitive devices under controlled temperature and humidity to prevent oxidation. MSL-classified parts are handled per J-STD-033.
🔴 SRC 15
STEP 15 · RELIABILITY
Constant Temperature & Humidity Test Machine
Environmental Test Chamber
Runs thermal and humidity cycling on finished boards to verify reliability under extreme operating conditions. Available for customers with explicit reliability test requirements.